• laser cleaner for semiconductor

Laser Cleaner

Utilizing a laser cleaner to reduce personal caused cleaning difference and achieve effect of cleaning by using laser energy to remove the tin dross.

Product Characteristics
  • Password lock to prevent parameter changes.
  • The firing limit angle can be set, and the firing is prohibited when the tilt angle of the gun head exceeds the limit.
  • Built-in power meter, with the function of measuring and adjusting energy.

Product Description

Advantages of Laser Cleaning in the Semiconductor Industry


  1. High-Precision Cleaning: Removes tiny contaminants (tin dross, photoresist residues, etc.) without damaging the substrate
  2. Non-Contact & No Consumables: Suitable for compact devices like smartphones
  3. Improves Yield Rate: Ensures conductivity and product stability
  4. Removes Micro Contaminants: Eliminates nano-scale particles and organic residues.
  5. Eco-Friendly & Cost-Effective: No chemical solvents, reducing pollution and disposal costs.
  6. Wide Application Range: Used for wafer, packaging, probe card, and PCB solder joint cleaning
  7. Precise Control: Adjustable laser parameters for optimal cleaning results Laser cleaning technology is widely used in semiconductor manufacturing due to its efficiency, precision, and eco-friendly nature, enhancing yield rate and process stability

Laser Cleaner Use Cases in Semiconductor


  • Pogo Pin Cleaning
    Before After
    pogo pin before laser cleaning pogo pin after laser cleaning
  • Finger Pin Cleaning
    Before After
    Finger Pin Before laser cleaning Finger Pin After laser cleaning

Product Specification

Max output power (1064nm)
When 1.5 Watts, corresponding to each energy is greater than 0.3 joules
Output power adjustment range (1064nm)
0.7 Watts to  1.5 Watts

Laser pulse width (1064nm)
below  50 ns (FWHM)
Operating temperature
between 15~40°C

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