BGA/QFN Final Test Socket

BGA Test Sockets

Ball Grid Array (BGA) test sockets are crucial in semiconductor testing, ensuring that integrated circuits (ICs) function correctly before being deployed in electronic devices. These sockets are vital for engineers and manufacturers, enabling precise and reliable testing of BGA-packaged components, which are widely used in various sectors, from consumer electronics to advanced telecommunications. With the rise of new technologies like artificial intelligence (AI) and 5G, which demand more rigorous testing procedures, the importance of BGA test sockets has grown significantly.

BGA TEST SOCKET EXPLOSION DRAWING

Custom design and manufacturing can be provided according to the different testing requirements of customers; currently, the smallest pitch is 0.3mm.

QFN Test Sockets

Quad Flat No-Lead (QFN) packages are increasingly popular in the semiconductor industry due to their compact size, excellent thermal performance, and electrical efficiency. As a result, the demand for QFN test sockets has surged, as these sockets play a crucial role in testing and validating QFN packages. QFN test sockets are essential for ensuring the reliability and functionality of QFN devices across various applications, from consumer electronics to automotive systems. Understanding the importance and applications of these sockets is key to selecting the right product for your specific needs.

QFN TEST SOCKET EXPLOSION DRAWING

Spring Exposed

Kelvin

Crown

Finger

➊ Guide Plate (4XG)     ➋ Housing (4XG)     ➌ 膠條     ➍ Finger pin

Features of QFN and BGA Test Sockets:

Our QFN and BGA test sockets are engineered for efficient testing, offering advanced features to ensure optimal performance:

1. Low Contact Resistance: Crafted with high-quality materials and precision engineering, our sockets provide exceptionally low contact resistance, ensuring accurate and stable signal transmission during testing.
2. Exceptional Durability: Rigorously tested for reliability, our sockets maintain stable performance even after numerous insertions, offering long-lasting use and reducing maintenance needs.
3. Wide Temperature Range: Designed to operate reliably under extreme temperature conditions, our sockets are suitable for a variety of testing environments.
4. Extended Cycle Life: Our QFN test sockets withstand thousands of insertion cycles, making them ideal for high-volume testing environments and maximizing testing efficiency.

Types of QFN and BGA Test Sockets:

We proudly offer a comprehensive range of QFN and BGA test sockets to meet diverse customer needs. Our product lineup includes spring pin sockets and pogo pin sockets, each designed for specific testing environments to ensure optimal performance:

1. Spring Pin QFN and BGA Test Sockets:
   Our spring pin sockets feature a robust design incorporating miniature springs and pins that adapt to pressure variations during testing, providing flexible contact. These sockets ensure stable and reliable connections, making them ideal for high-frequency insertion applications. With high durability and versatility, our spring pin sockets are well-suited for various package types, including high-density QFN and BGA packages, delivering consistent performance over time.
2. Pogo Pin QFN and BGA Test Sockets:
   We also offer pogo pin sockets, which use flexible metal contacts designed to engage or sweep across the contact points of the device under test. These sockets are ideal for applications requiring precise contact, offering high accuracy and low contact resistance for stable and accurate signal transmission. While typically used in high-precision testing environments, pogo pin sockets are engineered to deliver reliable performance over multiple test cycles.