News
在這裡，您可以找到各種最新資訊，包含展覽訊息、品捷新聞等等，我們將為您提供最新、最豐富的資訊。
請關注我們的最新消息，隨時了解最新資訊。
-
Boost Your Manufacturing Edge! A New CNC Machine Joins Our Team!
2024-05-17
Boost Your Manufacturing Edge! A New CNC Machine Joins Our Team!
Pin-Jet has reached an exciting milestone: we've acquired a high-speed machining center!
Exhibition Information
Blog
-
Head in Pillow Defect in BGA Soldering Process: Causes and Solutions
2024.12.27
Head in Pillow Defect in BGA Soldering Process: Causes and Solutions
Head-in-Pillow (HIP) is a common failure mode in the BGA (Ball Grid Array) soldering process, referring to incomplete fusion between the BGA solder ball and the PCB pad, resulting in a structure resembling a "pillow and head." This defect can lead to poor contact, affecting the performance and reliability of electronic components.
-
Understanding ESD: How It Damages Semiconductor Components and How to Prevent It
2024-12-23
Understanding ESD: How It Damages Semiconductor Components and How to Prevent It
Electrostatic Discharge (ESD) is a phenomenon caused by the transfer of electric charge between two objects that are statically charged. This typically occurs when two objects with different electrical potentials come into contact or are brought close together, resulting in a rapid discharge of static electricity and a sudden flow of current.
-
Wafer Test Probe
2024-12-23
Wafer Test Probe
Wafer Testing is an indispensable step in the semiconductor manufacturing process, responsible for inspecting the functionality and performance of each die on a wafer.
-
How to Clean Pogo Pins: Essential Tips for Effective Maintenance
2024-12-20
How to Clean Pogo Pins: Essential Tips for Effective Maintenance
Pogo Pin is a commonly used spring-loaded probe in semiconductor testing equipment, designed to establish stable electrical connections with electronic components during the testing process. With frequent usage, Pogo Pins are prone to contamination (e.g., oxides, solder residues, or dust), which can result in poor contact and subsequently affect the accuracy and efficiency of testing.
-
BGA (Ball Grid Array) Soldering Process: Defects and Solutions
2024-12-20
BGA (Ball Grid Array) Soldering Process: Defects and Solutions
The quality of solder balls in the BGA soldering process directly affects the performance and reliability of the product. Various defects, such as voids, bridging, misalignment, and cracks, may occur during the soldering process. These defects can result from factors like soldering materials, equipment parameters, process design, or storage conditions. By optimizing material selection, improving process parameters, and enhancing quality control, the occurrence of soldering defects can be significantly reduced, thereby improving product reliability and lifespan.
-
What is the Final Test in Semiconductor Manufacturing?
2024-06-27
What is the Final Test in Semiconductor Manufacturing?
In the semiconductor manufacturing process, the Final Test (FT) is a critical step that ensures each chip meets the expected performance standards before being shipped.
-
What is a QFN Socket? Key Benefits and Uses
2024-06-12
What is a QFN Socket? Key Benefits and Uses
QFN Socket (Quad Flat No-lead) is a type of leadless surface-mount package used for integrated circuits.
-
BGA Sockets Basics: Exploring Benefits and Application
2024-06-05
BGA Sockets Basics: Exploring Benefits and Application
A BGA socket (Ball Grid Array socket) is a type of surface mount packaging used for integrated circuits.
-
Test Sockets: Key Components in IC Testing
2024-05-29
Test Sockets: Key Components in IC Testing
This article will explore why Test Sockets are important, the different kinds there are, and how they are used in the semiconductor industry.
Contact Us Now
Complete online forms and Pin-Jet will have representatives to help you with professional services
