IC test sockets are pivotal in semiconductor manufacturing, acting as the crucial interface between ICs and testing equipment. These sockets ensure that ICs conform to performance and quality standards before integration into larger systems. Their adaptability to various IC package types, including BGA and QFN, is essential for their broad applicability across different applications. By providing stable and reliable connections during the testing process, IC test sockets facilitate the detection of defects, ensuring that only high-quality chips advance to the next production stage.
We provide high-quality IC test sockets specifically optimized for final testing in semiconductor manufacturing. Our offerings include PoP, BGA/QFN, standard, and surface-mount matrix sockets, all engineered for precision and durability in high-volume production. These sockets feature advanced thermal management and flexible design capabilities, ensuring that your ICs meet the most rigorous quality standards. PinJet’s solutions offer the reliability and accuracy necessary to ensure flawless performance before your product reaches the market.
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Package on Package Socket
Package on Package Socket
A Reference IC is required for comparison or memory operation during testing, and designed on the contact jig to shorten the electrical distance to get better effect on electricity.
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BGA/QFN Final Test Socket
BGA/QFN Final Test Socket
This is a commonly used type in the industry and can be applied to BGA/QFN/QFP...etc. In addition to pogo pin type socket, there are also finger pin type sockets.
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Burn in Socket
Burn in Socket
Burn-in test socket is mainly used in the performance testing, environmental testing and life testing for commercial products, industrial products, military goods, and so on.
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PCR Test Socket
PCR Test Socket
The conductive adhesive Socket has excellent electricity and is suitable for high-frequency, high-speed and other chip tests to ensure that the solder balls will not leave indentations.
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Wafer Test
PROBE HEAD Wafer TestCustomize sockets for WLCSP products to meet customers’ needs for multiple-site testing
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Change Kit
KIT Change KitProvide Pick & Place and SLT sorting machine jigs ranging from single site to 16 sites. The standard surface treatment we offer is hard anodizing. Anti-ESD surface treatment or special designs are also available at customer's request.
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Cleaning Tool
LASER CLEAN MACHINE Cleaning Tool
MoreThe Test Socket is a critical interface component in the semiconductor testing process, used to connect testing equipment with the device under test (such as BGA or QFN), enabling accurate functionality and performance testing.
As testing frequency and density increase, maintaining the cleanliness of the Test Socket becomes crucial for ensuring the accuracy of test results, extending equipment lifespan, and improving production efficiency.
Below are the key reasons why Test Socket cleaning is important:
- Ensure Testing Accuracy
- Extend the Test Socket's Lifespan
- Enhance Signal Integrity in High-Frequency Testing
- Reduce Defects and Retesting During the Testing Process
- Ensure Product Quality and Mitigate Market Risks
- Lower Maintenance and Replacement Costs of Testing Equipment
- Improve Production Line Efficiency
- Comply with Industry Standards and Customer Requirements
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