The Test Socket is a critical interface component in the semiconductor testing process, used to connect testing equipment with the device under test (such as BGA or QFN), enabling accurate functionality and performance testing.
As testing frequency and density increase, maintaining the cleanliness of the Test Socket becomes crucial for ensuring the accuracy of test results, extending equipment lifespan, and improving production efficiency.
Below are the key reasons why Test Socket cleaning is important:
- Ensure Testing Accuracy
- Extend the Test Socket's Lifespan
- Enhance Signal Integrity in High-Frequency Testing
- Reduce Defects and Retesting During the Testing Process
- Ensure Product Quality and Mitigate Market Risks
- Lower Maintenance and Replacement Costs of Testing Equipment
- Improve Production Line Efficiency
- Comply with Industry Standards and Customer Requirements
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Laser Cleaner
Laser Cleaner
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Socket Brush
Socket Brush
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Clean Pad
Clean Pad
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Non-stick Coating
Non-stick Coating
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Final IC Test Socket
SOCKET Final IC Test SocketIC test sockets are pivotal in semiconductor manufacturing, acting as the crucial interface between ICs and testing equipment. These sockets ensure that ICs conform to performance and quality standards before integration into larger systems. Their adaptability to various IC package types, including BGA and QFN, is essential for their broad applicability across different applications. By providing stable and reliable connections during the testing process, IC test sockets facilitate the detection of defects, ensuring that only high-quality chips advance to the next production stage.
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We provide high-quality IC test sockets specifically optimized for final testing in semiconductor manufacturing. Our offerings include PoP, BGA/QFN, standard, and surface-mount matrix sockets, all engineered for precision and durability in high-volume production. These sockets feature advanced thermal management and flexible design capabilities, ensuring that your ICs meet the most rigorous quality standards. PinJet’s solutions offer the reliability and accuracy necessary to ensure flawless performance before your product reaches the market.
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Wafer Test
PROBE HEAD Wafer TestCustomize sockets for WLCSP products to meet customers’ needs for multiple-site testing
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Change Kit
KIT Change KitProvide Pick & Place and SLT sorting machine jigs ranging from single site to 16 sites. The standard surface treatment we offer is hard anodizing. Anti-ESD surface treatment or special designs are also available at customer's request.
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