Handler Change Kit

Product Characteristics

Pick & Place、SLT Model

Provide Pick & Place and SLT sorting machine jigs ranging from single site to 16 sites. The standard surface treatment we offer is hard anodizing. Anti-ESD surface treatment or special designs are also available at customer's request.

Product Description

Understanding Handler Change Kits

A Handler Change Kit is a specialized tool that allows automated test equipment (ATE) to accommodate various IC package types. These kits are composed of precisely engineered fixtures or accessories, designed to interact with the tester's handling systems during the testing process. They facilitate the accurate positioning of devices for testing, and ensure their proper sorting into designated storage bins based on test results. This adaptability is essential in semiconductor testing environments where the efficient processing of diverse device types and sizes is critical.


Key Features of Handler Change Kits

Pin-Jet's Handler Change Kit delivers several critical features that establish it as an essential tool in semiconductor manufacturing:

  • Adaptability: These kits empower a single test handler to accommodate various device types, enhancing flexibility and reducing overall costs. By facilitating seamless transitions between different test configurations, the Handler Change Kit ensures a versatile testing process and allows for rapid adaptation to diverse devices under test (DUTs).
  • Precision: The precise and gentle handling of sensitive semiconductor devices is paramount. The Handler Change Kit is meticulously engineered to maintain exceptional accuracy, minimizing the risk of device damage during testing. This precision is vital for acquiring reliable data and maintaining product quality.
  • Efficiency: The Handler Change Kit optimizes the testing workflow by enabling swift transitions between different device requirements, thereby reducing downtime and increasing production efficiency. This leads to a more streamlined and cost-effective testing process.



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Product Specification

Kit-series
Base
Hot Plate
Shuttle
Clamp
T6鋁合金,SUS303
T6鋁合金
T6鋁合金
T6鋁合金 , PEEK , TR4230
-40°C~800°C
-40°C~300°C
-40°C~300°C
-40°C~300°C
NA
10   ~10  Ω/sq
10   ~10  Ω/sq
10   ~10  Ω/sq
±0.02mm
±0.02mm
±0.02mm
±0.02mm
Positioned, Ducking, Fixed L/B & Socket & M/C
Pre-Heat, Heating,positioned
Pre-Heat, Heating,positioned
Pre-Heat, Heating,positioned
Electrical ESD series
T6 Haed Anodizing
EZD 420
ESD Coating
T6 Haed Anodizing
EZD 420
T6鋁合金
-40°C~800°C
-60°C~260°C
-60°C~700°C
1010~1012 Ω/sq
106~109Ω/sq
106~109Ω/sq
±0.01mm
±0.01mm
±0.01mm
Common use
Stable impedance
耐磨高導熱

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