Wafer Test Probe

Wafer Testing is an indispensable step in the semiconductor manufacturing process, responsible for inspecting the functionality and performance of each die on a wafer. This process is typically carried out before packaging to efficiently identify good dies that meet design specifications while avoiding resource waste. In wafer testing, the Probe Head plays a pivotal role as it directly affects the accuracy and efficiency of the testing process.

The Probe Head is a critical component in wafer testing, used to establish electrical connections. It uses fine probes to contact the test pads on the wafer's surface, transmitting test signals from the Automatic Test Equipment (ATE) to the dies.