QFP Final Test Socket

Product Features:

This is a commonly used type in the industry and can be applied to BGA/QFN/QFP...etc. In addition to pogo pin type socket, there are also finger pin type sockets. We can provide customized Socket design based on your needs.

Product Description

Quad Flat Package (QFP)

Quad Flat Package (QFP) devices remain widely used in the semiconductor industry due to their high lead count and outward-extending gull-wing lead design. Even as packaging technologies continue to evolve, QFP packages retain strong value across various applications thanks to their excellent testability and proven reliability.

To ensure stable and reliable testing performance, QFP devices typically require dedicated test sockets or automated test equipment (ATE) for validation.

In consumer electronics, as well as in certain low- to mid-pin-count microcontroller (MCU) applications, QFP test sockets play a critical role in the testing process. They not only ensure accurate electrical contact, but also help improve test efficiency and reduce overall testing costs.

By selecting the appropriate QFP test socket and fully understanding its features and application scenarios, customers can implement test solutions that best meet their requirements—effectively enhancing test efficiency and ensuring consistent product quality.


Features of QFP Test Sockets:

Our QFP test sockets are specifically designed for functional testing of QFP-packaged devices, delivering stable and reliable electrical connections. They are suitable for a wide range of test environments and application requirements, helping customers effectively improve testing efficiency and measurement accuracy.

  1. High Pin-Count Compatibility: Even for QFP devices with a high number of leads, the socket structure maintains precise alignment, ensuring consistent and repeatable test results.

Product Specification

搭配探針規格

PKG
MODEL
SIZE
PIN COUNT
PITCH
BGA
POGO
3x3 - 50x50
9 - 3000
1.0 - 0.3mm
QFN
1.1x1.1 - 15x15
4 - 144
1.0 - 0.35mm
QFP
5x5 - 31x31
28 - 296
1.0 - 0.35mm
QFN
FINGER
3x3 - 12x12
9 - 128
1.0 - 0.35mm
QFP
5x5 - 24x24
28 - 216
1.0 - 0.35mm
SPEC
Package
BGA, QFN, QFP
Pitch
>=0.25
Resistance
<=100mOhm
Bandwith
-1dB @40GHz
Bandwith
-1dB @40GHz
Temperature
-60~200
Current rating
0.5~7A

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